Advanced System in Package Technologies Pvt Ltd (ASIP)

Relationships

• supportsIndia Electronics and Semiconductor Association (IESA)— IESA supports ASIP Technologies AP
• related toFCBGA packaging gap— ASIP Technologies is the first Indian FCBGA packaging facility
• Customer ofIndia Semiconductor Mission (ISM) / Modified Scheme— ASIP Technologies is a customer of ISM scheme incentives
• Depends onIC substrate (flip-chip, BGA)— ASIP Technologies depends on imported IC substrates (FCBGA requires high-end substrates)
• Depends onBonding wire (Au, Cu, PCC)— ASIP Technologies depends on imported bonding wire
• Depends onHeraeus Precious Metals — Bonding Wire— ASIP depends on Heraeus for bonding wire
• Depends onATE system (SoC test)— ASIP Technologies depends on imported ATE
• Depends onTanaka Holdings— ASIP depends on Tanaka for bonding wire
• Depends onWire bonder— ASIP Technologies depends on imported wire bonders