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IC substrate

Engineered package substrate carrying the die and connecting it to the board. India has no domestic producer at scale; Shinko, IBIDEN and Unimicron hold roughly 70% of the world market. Glass-core substrates are the emerging frontier variant.

Connected from —
  • Intel-3DGS Substrate Plant, Bhubaneswar-Khurda (facility) produces this
  • Shinko Electric Industries (foreign_supplier) Supplies to this
  • IBIDEN (foreign_supplier) Supplies to this
  • Unimicron (foreign_supplier) Supplies to this
  • Semicon 2.0 (scheme) supports this

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