PM Roundtable Moves the Conversation from Project Approvals to Ecosystem Depth
- PM Modi chaired a Semiconductor Roundtable with global and Indian chip CEOs in New Delhi on 16 September 2026, ahead of SEMICON India 2026.
- Attendees included ASML, Applied Materials, Lam Research, Tokyo Electron, Micron, Infineon, AMD, Intel, Tata Electronics, NXP and Foxconn.
- The government reiterated a predictable policy environment and pushed collaboration on skilling, AI and quantum computing.
- The strategic test is whether equipment, materials and design majors localise capability rather than remain arm's-length suppliers under Semicon 2.0.
- PM Modi chaired a Semiconductor Roundtable with global and Indian chip CEOs in New Delhi on 16 September 2026, ahead of SEMICON India 2026.
- Attendees included ASML, Applied Materials, Lam Research, Tokyo Electron, Micron, Infineon, AMD, Intel, Tata Electronics, NXP and Foxconn.
- The government reiterated a predictable policy environment and pushed collaboration on skilling, AI and quantum computing.
- The strategic test is whether equipment, materials and design majors localise capability rather than remain arm's-length suppliers under Semicon 2.0.
- Prime Minister's Office / PIB (16 Sep 2026): https://www.pib.gov.in/PressReleasePage.aspx?PRID=2311054
- ANI (16 Sep 2026): https://www.aninews.in/news/national/general-news/pm-modi-chairs-semiconductor-roundtable-with-ceos-reiterates-commitment-to-predictable-policy-environment20260916225002/
- Business Standard (16 Sep 2026): https://www.business-standard.com/india-news/pm-modi-meets-chip-ceos-seeks-push-for-next-phase-of-semicon-growth-126091601227_1.html
The development
On 16 September 2026, a day before SEMICON India 2026 opened, Prime Minister Narendra Modi chaired a Semiconductor Roundtable with leading global and Indian industry heads in New Delhi. Attendees included senior leaders from SEMI, Micron, Infineon, Applied Materials, ASML, Merck, Tokyo Electron, AMD, Intel, Tata Electronics, Lam Research, Rapidus, NXP, Foxconn and CG Power. The discussion moved from foundational project approvals to deeper industry participation in talent development, research and emerging-technology domains, with the government reiterating a commitment to a predictable policy environment and inviting industry inputs on further measures.
Why it matters
India has already approved twelve semiconductor units and notified Semicon 2.0 with a Rs 1,27,500 crore outlay. The next phase is no longer about attracting the first wave of fabs and OSATs; it is about whether global equipment, materials, design and process players embed deeper local capability rather than remaining arm's-length suppliers. The Prime Minister's emphasis on skilling, AI and quantum applications points to where the government wants industry to commit beyond manufacturing lines.
The dependency and systems frame
The roundtable underscores a structural shift: the binding constraint is moving from policy intent and project approvals to the equipment, materials and design layers that still sit largely outside domestic control. Sovereign capability will be measured by how much of the tools-and-process stack is localised, not by the number of packaging or mature-node facilities commissioned. A room full of equipment and materials majors is the right audience for that pitch; the question is what they commit to build, not merely to attend.
What to watch
- Whether global equipment and materials firms convert roundtable goodwill into manufacturing or deep-R&D footprints in India.
- Progress on local supplier development under Semicon 2.0's six pillars.
- Concrete industry proposals on skilling and quantum/AI semiconductor applications that move beyond statements of intent.
Track the systems we watch
Signals, reports and briefings on India’s industrial transformation.