Aheesa achieves first-pass silicon success with VIHAAN networking SoC
- Aheesa Digital Innovations (Chennai) achieved first-pass silicon success with VIHAAN networking SoC on 15 August 2026, after taping out on Republic Day 2026
- VIHAAN is purpose-built for fibre broadband and built on the indigenous VEGA microprocessor by Incore Semiconductor
- Company raised Rs 40 crore from TNIFMC through TNESSF and other private investors to accelerate product development
- DLI Scheme-backed companies have cumulatively achieved 35 chip design tape-outs and raised over US$100 million in VC funding
- Aheesa Digital Innovations (Chennai) achieved first-pass silicon success with VIHAAN networking SoC on 15 August 2026, after taping out on Republic Day 2026
- VIHAAN is purpose-built for fibre broadband and built on the indigenous VEGA microprocessor by Incore Semiconductor
- Company raised Rs 40 crore from TNIFMC through TNESSF and other private investors to accelerate product development
- DLI Scheme-backed companies have cumulatively achieved 35 chip design tape-outs and raised over US$100 million in VC funding
- Press Information Bureau (15 August 2026): https://www.pib.gov.in/PressReleasePage.aspx?PRID=2299883
- Hindu Business Line (15 August 2026): https://www.thehindubusinessline.com/info-tech/indian-semiconductor-startup-aheesa-achieves-first-pass-success-with-vihaan-chip/article71349976.ece
- NewKerala (15 August 2026): https://www.newkerala.com/news/a/dli-backed-indian-chip-startup-achieves-first-pass-silicon-success-491.htm
Aheesa Digital Innovations, a Chennai-based fabless semiconductor startup backed by the Design Linked Incentive (DLI) Scheme, achieved first-pass silicon success with its VIHAAN chip on 15 August 2026. VIHAAN is a networking System-on-Chip (SoC) purpose-built for fibre broadband applications, designed using the indigenous VEGA microprocessor developed by Incore Semiconductor. The chip was initially taped out on Republic Day (26 January 2026) and has now been validated in silicon. Aheesa will proceed towards production tape-out, targeted for 2027. The company raised approximately Rs 40 crore earlier this year from the Tamil Nadu Infrastructure Fund Management Corporation (TNIFMC) through the Tamil Nadu Emerging Sector Seed Fund (TNESSF), alongside other private investors.
First-pass silicon success is a significant technical milestone in chip development. It means the chip functioned correctly on its first fabricated iteration, without requiring design corrections. This is particularly notable for a startup, as first-pass success reduces both time-to-market and development costs substantially. The use of the indigenous VEGA microprocessor also demonstrates that Indian chip design is increasingly building on domestically developed IP cores rather than exclusively licensing foreign architectures.
The dependency frame: fibre broadband is a critical infrastructure component for India's digital economy, and networking SoCs for optical fibre equipment have traditionally been sourced from foreign suppliers such as Broadcom, Marvell, and Realtek. A domestically designed SoC for this application, if it reaches volume production, would reduce import dependence in a segment that is essential for rural broadband expansion and 5G backhaul. The DLI Scheme's broader track record — 35 tape-outs and over US$100 million in cumulative VC funding across supported companies — indicates a maturing design ecosystem.
The test to watch is whether VIHAAN achieves volume production by 2027 and secures design wins with fibre broadband equipment manufacturers. Success would validate the DLI Scheme's model of supporting Indian fabless companies and could encourage further investment in networking silicon. The parallel achievement by other DLI-backed companies — Vervesemi's BLDC motor controller, Netrasemi's 12nm Vision SoC, and OptoML's compute-in-memory SoC — suggests the ecosystem is producing multiple validated designs across different application domains simultaneously.
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