Semiconductor Advanced Packaging (opportunity stream)
2.5D/3D and chiplet packaging, OSAT/ATMP deepening into the value-capture layer. ~Rs 9,160 cr/yr by 2035 [modelled]. India OSAT cost-arbitrage vs Taiwan a defensible moat.
Relationships
- part ofSemicon 2.0 Ecosystem— Value-capture layer; large pool.
- part ofMicron ATMP Sanand— Anchor ATMP facility in the packaging stream.
- part ofOSAT / ATMP services— OSAT/ATMP is the base of the advanced-packaging stream.
- part ofTata Semiconductor Assembly and Test— Anchor ATMP facility in the packaging stream.
- part ofCG Semi Private Limited— CG Semi is an OSAT/backend anchor.