Outsourced Semiconductor Assembly and Test
OSAT covers assembly, testing, marking and packaging of semiconductor devices. It is India most active near-term semiconductor manufacturing layer, with Micron, Tata Electronics, CG Power and Kaynes-linked projects clustered around Gujarat and Assam.
OSATATMPAdvanced packagingSanandJagiroad
Reference data
Key facts
Known India clusterSanand, Dholera and Jagiroad are emerging as semiconductor packaging and fabrication nodes.Cabinet approval and industry reporting on India semiconductor projects
Reported Tata Assam capacity48 million chips per day assembled at planned scaleCabinet approval and industry reporting on India semiconductor projects
Reported Kaynes ATMP capacity6.3 million chips per dayCabinet approval and industry reporting on India semiconductor projects
Tata Assam investmentRs 27,000 croreCabinet approval and industry reporting on India semiconductor projects
Kaynes ATMP investmentRs 3,307 croreCabinet approval and industry reporting on India semiconductor projects
Proprietary scores
Strategic profile
Industrial importance5/5
Strategic importance4/5
Localization potential5/5
Import dependency3/5
Technology complexity4/5
Capital intensity4/5
Knowledge graph
Mapped relationships
- EnablesIndia Semiconductor Mission- Policy support for ATMP and OSAT projects.
- IncludesSemiconductor OSAT supply chain
- EnablesAdvanced semiconductor packaging