Advanced semiconductor packaging
Advanced packaging increases chip performance by integrating dies, substrates and interconnects after wafer fabrication. For India, it is a practical capture layer between chip design and full front-end fabrication.
Advanced packagingSubstratesHeterogeneous integration
Reference data
Key facts
OpportunityPackaging is closer to India current manufacturing base than EUV-class front-end tools.Cabinet approval and industry reporting on India semiconductor projects
Proprietary scores
Strategic profile
Industrial importance5/5
Strategic importance5/5
Localization potential5/5
Import dependency4/5
Technology complexity5/5
Capital intensity4/5
Knowledge graph