Packaging substrate
Packaging substrates provide interconnect between silicon dies and printed circuit boards. Substrate capability is a major bottleneck in advanced packaging and a natural supplier-development target for India OSAT ecosystem.
Packaging substrateAdvanced packagingOSATInterconnect
Proprietary scores
Strategic profile
Industrial importance5/5
Strategic importance5/5
Localization potential5/5
Import dependency5/5
Technology complexity5/5
Capital intensity4/5
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