Opportunity surface · IN
Semiconductor Advanced Packaging (opportunity stream)
2.5D/3D and chiplet packaging, OSAT/ATMP deepening into the value-capture layer. ~Rs 9,160 cr/yr by 2035 [modelled]. India OSAT cost-arbitrage vs Taiwan a defensible moat.
This opportunity surface —
- part of Semicon 2.0 Ecosystem (ecosystem)
Connected from —
- Micron ATMP Sanand (facility) part of this
- OSAT / ATMP services (process) part of this
- Tata Semiconductor Assembly and Test (facility) part of this